S S S t t t a a a n n n n n n a a a t t t e e e c c c h h h 可焊性试验 (Solderability Test) 测试方法 印制板(PCB)的可焊性可以表明在组装期间所期望的印制板状态。
基于371个网页-相关网页
... solder thermoelectric refrigerating unit 焊接式半导体制冷器 solderability test 焊接性试验 soldering 软焊，热焊接 ...
基于28个网页-相关网页
Edge-Dip Solderability Test 板边焊锡性测试
Solderability test of coating 镀层可焊性试验
Solderability Test for Printed Boards 印制板可焊性试验
Solderability test method 可钎焊性的试验方法
Surface Mount Solderability Test 表面安装可焊性测试
Tin solderability test 锡焊性试验
Solderability test apparatus 可焊性的测试设备
Are solderability test samples archived for one year?
焊锡性样品是否至少保留一年？
Is the solderability test frequency being performed at a minimum of once per lot?
焊锡性测试最小测试频率是否为每批一次？
Water vapor aging test whether experiment: discoloration or corrosion, and the subsequent spots solderability.
水蒸气老化实验：测试是否变色或腐蚀斑点，及后续的可焊性。
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